Fast Curing SMD adhesive
04 December 2017
Techsil has launched a fast curing epoxy adhesive Structalit 5610 from manufacturer Panacol. This adhesive is designed for bonding Surface Mounted Devices (SMDs) on to circuit boards. Due to its high viscosity the adhesive is well-suited for screen printing.
Structalit 5610 is a red-coloured epoxy adhesive which contrasts with green circuit boards. The one-component adhesive is easily applied via dispenser, screen printing or needle transfer.
The SMD adhesive cures thermally within minutes, even at low temperatures. At the same time it is highly temperature-resistant: Temporarily it can be exposed to temperatures to 280°C, making it suitable for reflow soldering.
Once cured, Structalit 5610 is extremely shock-resistant and features very high adhesion to FR4 circuit boards, to metals and to epoxy-based mould materials.