Using a preparatory formulation applied to one or both faces of the parts to be joined, the bonding technique delivers high tensile strength. The process is suitable for bonding both porous and fully dense ceramics, making it ideal for a variety of applications from fluid handling systems to diode pump lasers.

Internal testing of the new bonding technology has delivered impressive results, with a bond strength of 132 MPa and a force to failure of 11,330kgf.