Altus Group Ltd
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Altus toasts a decade of 3D SPI innovation

3D SOLDER Paste Inspection (SPI) systems have been a game-changer in reliable electronics, ensuring that complex PCBAs are fail-safe. A trailblazer for this innovative inspection is Koh Young. Recently celebrating 20 years of innovation and ten years since they introduced the concept of 3D measurement-based solder paste inspection, Altus, a leading distributor of capital equipment in the UK and Ireland, looks back at how 3D SPI has revolutionised the inspection industry.

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