tML master splice box: compact design and effortless installation
TRANS DATA elektronik (TDE) has completely revised the tML master splice box and designed it for an even higher packing density with a compact design and effortless installation.
TRANS DATA elektronik (TDE) has completely revised the tML master splice box and designed it for an even higher packing density with a compact design and effortless installation.
TRANS DATA elektronik continues to drive forward its technological leadership in the modular cabling system field for maximum packing efficiency, investment security and simple migration currently up to 800 G and more: tde is the first network expert in Europe to integrate the MMC connector from US Conec into its successful tML system platform, thereby doubling the packing density of its cabling systems.
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