As a founding member of the IO-Link consortium and the market leader in Distributed Modular I/O utilising IO-Link, Balluff is said to offer the most devices available in the market encompassing I/O and connectivity solutions.

Visitors will be able to find about how I-O Link can be easily integrated in existing systems to help reduce maintenance costs, achieve optimum efficiency and productivity while reducing downtime; gone are the days of a single faulty device causing mass facility shutdowns.

As it is network neutral, IO-Link also offers flexibility and can be easily configured across multiple vendors, thus reducing the cost of design and implementation. A simplified installation process through a uniform standard interface is as easy as attaching a standard connector!

Balluff will also be showcasing a variety of technologies including object detection, vision, industrial identification and fluid sensors for the primary, secondary or end-of-line packaging industry. Our aim is to add value to automated systems by providing a wide range of enabling technologies that unlock hidden productivity potential. Stand F50