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Call for papers for CM 2020 conference

21 January 2020

The British Institute of Non-Destructive Testing (BINDT) has issued a call for papers for the Seventeenth International Conference on Condition Monitoring and Asset Management (CM 2020).

The conference will take place from Tuesday 30 June to Thursday 2 July 2020 at the Park Inn by Radisson Hotel and Conference Centre, London Heathrow, UK. The theme for CM 2020 will be: ‘The future of condition monitoring’.

CM 2020 will provide attendees with a unique opportunity to network with academics and industrialists from all over the world. Leading figures in the fields of CM and asset management will be presenting at the conference, with the very latest developments in these fields being revealed, ensuring all attendees will learn something.

The conference is being organised by BINDT in close partnership with the International Society for Condition Monitoring (ISCM) and the US Society for Machinery Failure Prevention Technology (MFPT). This combination of the efforts of these leading organisations creates one of the largest events of its kind at a truly international level and builds on the highly successful 16 international condition monitoring conferences organised by BINDT, the First World Congress on CM in 2017 organised by BINDT and ISCM and 71 annual conferences organised by the Society for MFPT.


Papers are invited on all aspects of CM including:

  • Artificial intelligence, machine learning and pattern recognition
  • Asset management
  • Big data and data analytics for CM
  • Certification, education and training in CM
  • CM systems and case studies
  • CM for biomedical and healthcare applications
  • CM and diagnosis methods and technologies
  • Data mining and fusion
  • Design and lifecycle integrity
  • Digitisation of CM
  • Engineering standards in CM
  • Equipment troubleshooting
  • Instrumentation for CM
  • Integrated vehicle health management (IVHM)
  • Internet of Things (IoT)
  • Machinery failure analysis and prevention
  • Maintenance including planning, scheduling, repair and overhaul
  • Materials and structure health monitoring
  • Modelling and signal processing for CM
  • NDT
  • Physics of failure, fault/failure modes
  • Prognostics
  • Risk assessment
  • Root cause analysis
  • Sensors and actuators