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Edward Lowton
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High definition plasma cutting
07 November 2013
Kerf Developments says recent collaboration with its technology partners has resulted in a new process that resets the standard in high definition plasma cutting.

The process can pierce and cut mild steel up to 60mm thick, however it is with material in the 12 to 30mm thickness range that the company sees the major potential for its new technology.
Kerf says the Ultrasharp process will cut 20mm mild steel typically three times faster than a laser. Furthermore, the required investment levels are a fraction of the cost in terms of acquisition and ongoing running costs.
Sales director Craig Walsh says: "We see the Kerf Ultrasharp process as an alternative to laser for a large majority of cutting applications. The new enhancements for the high definition plasma process produce an excellent edge quality but more importantly addresses the issue of hole cutting with plasma. The result is what is classed as 'bolt ready' holes with draft angles on internal and external profiles of less than 2°."
"We see a huge market for Ultrasharp with companies who are running traditional oxy-fuel, plasma or laser machines, as we can complement these systems with the Kerf Ultrasharp technology. For those manufacturers with a suitable application for the process, we can offer a wide range of machine widths and lengths and put together cost-effective turnkey packages."
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