Protection for electronics

LPO uses low viscosity 'hotmelt' adhesives applied under low pressure. Using process specific moulding machines, the mould tooling is manufactured from aluminium to keep costs low and lead-times short.

For some applications LPO has replaced more complex, time consuming processes such as potting, where a separate housing is required and a two part moulding compound  is often used. In addition it gives off no toxic fumes. It is said to enable more complex mould designs and to be a cost effective method for protecting electronic assemblies. Stand A29