ARTICLE

Protection for electronics

31 July 2013

EC Electronics offers a Low Pressure Overmoulding ( LPO) process that protects electronic components on printed circuit board assemblies and cable assemblies, where sealing and strain relief is needed.


LPO uses low viscosity 'hotmelt' adhesives applied under low pressure. Using process specific moulding machines, the mould tooling is manufactured from aluminium to keep costs low and lead-times short.


For some applications LPO has replaced more complex, time consuming processes such as potting, where a separate housing is required and a two part moulding compound  is often used. In addition it gives off no toxic fumes. It is said to enable more complex mould designs and to be a cost effective method for protecting electronic assemblies. Stand A29

 
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